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GDSI in San Jose, California
(408) 451-2000 x110
925 BERRYESSA RD
San Jose, CA 95133-1001
Company Description:
gdsi: grinding & dicing, services, inc. wafer services and products, including, backgrinding, dicing, pick and place, semiconductors, bare die, tape and reel, wafer polishing, bumped wafers, sawing. also: uv, non-uv tapes, wafer die sort, die pick and place, die inspection. silicon, gaas, quartz, wafer, backgrinding, grind, wafers, die, reel, tape, flip chip, services, polishing, dicing, backside, grinding, silicon, gaas, sunnyvale, valley, california, ca, polishing, wafer polishing, silicon polishing,grinding tapes, dicing tapes, wafer grinding, wafer dicing, die sort, die pick and place, die inspection. sunnyvale, california, silicon valley bay area, northern ca.
Services Offered:
Web Results:
- Wafer Grinding Wafer Polishing Wafer Dicing Wafer Inspection...
408-451-2000 HomeMediaRequest FormContact Extremely High Processing Quality Thin wafer dicing with extremely high processing quality, that is what customers have come to expect from GDSI. Dicing is the process by which individual silicon chips or integrated circuits on a silicon wafer are separated ...
- Wafer Grinding Wafer Polishing Wafer Dicing Wafer Inspection...
- 408-451-2000 HomeMediaRequest FormContact Production Level Speed Our automated pick and place equipment allow us to deliver your job at Production Level Speed. Due to the delicate nature of the product (particularly on the active side of the die), skillful tool use reduces die contact to a minimum w...
- Wafer Grinding Wafer Polishing Wafer Dicing Wafer Inspection...
- 408-451-2000 HomeMediaRequest FormContact ISO 9001:2008 Quality Assurance is smart business for both the customer and supplier alike. Like any worthwhile investment with promises of a future return, GDSI has invested heavily in the establishment of a "quality" culture defined by our Quality Manageme...
- Wafer Grinding Wafer Polishing Wafer Dicing Wafer Inspection...
408-451-2000 HomeMediaRequest FormContact Flawless Accuracy Flawless accuracy while ensuring high yield rates is our objective. GDSI delivers complete backgrinding solutions to all market segments within the semiconductor industry. Backgrinding is used to reduce wafers from their original thickness ...
- Wafer Grinding Wafer Polishing Wafer Dicing Wafer Inspection...
- 408-451-2000 HomeMediaRequest FormContact Changing the Future Thin wafer technology increases the function density of IC packaging, enabling the development of more portable electronics. To achieve the desired results for your specific project, GDSI continuously researches emerging applications targ...
Business Information:
| In Business Since: | 1992 |
| Business Sector: | Residential, Commercial |
Related Categories:
Website Links:
G D S I/Grinding & Dicing Svcs., Inc. | Click here if you would... | Request Form