ATCO designs and manufactures equipment for electronic assembly, soldering, rework & repair, and thermal stress testing of printed circuit boards. Systems produced include: SMD / BGA Rework Stations, Flip Chip / Die Bonders, Reflow Ovens, and Reflow Simulator & Thermal Stress Tester.
In Business Since: | 2010 |
Monday: | AM 9:00 to PM 5:00 |
Tuesday: | AM 9:00 to PM 5:00 |
Wednesday: | AM 9:00 to PM 5:00 |
Thursday: | AM 9:00 to PM 5:00 |
Friday: | AM 9:00 to PM 5:00 |
Saturday: | Closed |
Sunday: | Closed |
ADVANCED TECHNIQUES US., INC. | Related Resources | 4-Ball BGA 0.8mm x 0.8mm... | Wafer Level Chip Scale... | SMT / BGA Rework Stations | Automating Reflow of... | Micro BGA / CSP Rework | QFN / MLF Rework | Our Customers | BGA / SMT Rework | Reflow Soldering Ovens | SMT Pick & Place equipment